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SYCN210LT18BB
SYCN210LT18BB
TOPCon Series
Eff
≥26.5%
%
Thickness：
130±15
μm
Dimension：
210×182.2±0.25
mm
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SYCN210LT18BB
Features
Parameters
Features
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High efficiency:
N-type wafer:
Low temperature coefficient:
Low CTM loss:
PID and UVID resistance:
Excellent performanc at low intensity:
Parameters
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Eff
≥26.5%
%
Thickness：
130±15
μm
Dimension：
210×182.2±0.25
mm
Recommended
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SYCN210RT16BB
≥26.5% %
Eff:
130±15 μm
Thickness：:
182.2×210±0.25 mm
Dimension：:
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