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SYCN210LT18BB
SYCN210LT18BB
TOPCon Series
Eff
≥26.5
%
Thickness
130±15
μm
Dimension
210×182.2±0.25
mm
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SYCN210LT18BB
Features
Parameters
Features
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High efficiency:
N-type wafer:
Low temperature coefficient:
Low CTM loss:
PID and UVID resistance:
Excellent performanc at low intensity:
Parameters
Brochure
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Dimension
210×182.2±0.25
mm
Eff
≥26.5
%
Thickness
130±15
μm
Recommended
View More
SYCN210RT16BB
≥26.5 %
Eff:
130±15 μm
Thickness:
182.2×210±0.25 mm
Dimension:
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